EK-Loop Thermal Paste NGP (1g)

Engineered for efficiency and reliability, the EK-Loop Thermal Paste NGP features very low thermal impedance, ensuring effective heat conductivity and enhanced system performance. Its optimized formula offers excellent crumpling resistance and long-term stability, performing consistently within a temperature range of -20°C to 125°C.

This high-quality thermal paste is notable for its user-friendly application. Its syringe design allows for precise and clean application, and each package includes a high-quality black spatula to aid in applying the perfect layer. The EK-Loop Thermal Paste NGP's user-friendly consistency ensures it is easy to spread, maintaining a consistent application without the risk of electric conductivity issues.

Packaged in a practical one-gram (1g) syringe, the EK-Loop Thermal Paste NGP is an ideal solution for enthusiasts, system builders, and IT professionals seeking a high-performance thermal interface material.

Safety Data Sheet

• Ease of Use
• Excellent Applicability
• Low Thermal Impedance
• Good Crumpling Resistance
• High Reliability and Durability

Technical Specifications:

• Color: Gray
• Volatilization Rate (24H@200°C) %: < 0.5
• Density (g/cc): 2.98
• Viscosity (mPa.s): 1000~2000
• Continuous Using Temperature (°C): -20° to 125°
• Thermal Conductivity (W/mK): 6.9
• Thermal Impedance (°C·cm2/W): 0.09
• Pressure (psi): 40

Engineered in Europe, Produced in China