EK-Loop Thermal Paste NGP (5g)

EK-Loop Thermal Paste NGP (5g) is a reliable thermal compound, optimized for demanding computing environments. Utilizing advanced Nano Grade Particle (NGP) technology, this thermal paste facilitates efficient heat transfer between CPUs, GPUs, or any other chipsets and their cooling solutions, including water blocks and heatsinks. 

Engineered for efficiency and reliability, the EK-Loop Thermal Paste NGP features very low thermal impedance, ensuring effective heat conductivity and enhanced system performance. Its optimized formula offers excellent crumpling resistance and long-term stability, performing consistently within a temperature range of -20°C to 125°C.

This high-quality thermal paste is notable for its user-friendly application. Its syringe design allows for precise and clean application, and each package includes a high-quality black spatula to aid in applying the perfect layer. The EK-Loop Thermal Paste NGP's user-friendly consistency ensures it is easy to spread, maintaining a consistent application without the risk of electric conductivity issues.

Packaged in a practical five-gram (5g) syringe, the EK-Loop Thermal Paste NGP is an ideal solution for enthusiasts, system builders, and IT professionals seeking a high-performance thermal interface material.

Safety Data Sheet

Features:

• Ease of Use
• Excellent Applicability
• Low Thermal Impedance
• Good Crumpling Resistance
• High Reliability and Durability

Technical Specifications:

• Color: Gray
• Volatilization Rate (24H@200°C) %: < 0.5
• Density (g/cc): 2.98
• Viscosity (mPa.s): 1000~2000
• Continuous Using Temperature (°C): -20° to 125°
• Thermal Conductivity (W/mK): 6.9
• Thermal Impedance (°C·cm2/W): 0.09
• Pressure (psi): 40

Engineered in Europe, Produced in China